Printed circuit boards, otherwise known as PCB are found in almost all electronic devices. In manufacturing of PCB, electricians who are amateurs can make their own boards by drawing a design and then giving it to the manufacturer. There are three types; single sided, multi layered and double side boards. They are usually conducted with nickel, copper or aluminum material, and the type used is determined by the complexity and density of the circuits. The process of making them is described below.
The backing is first plated using a conductive material. Into it, holes are drilled in order for the improvement of conduction in between the layers. Scrubbing of the board is performed to get rid of any unwanted small particles of the conductor. These are then recycled using such methods as filtration. In case the copper particles are not recycled, there could be serious environmental impact if it combines with the other wastes.
Cleaning of the board is then done. In the next stage, there should be adequate adhesion and therefore to enhance this, etching is also done. One more layer of conductor is added next. The holes that had been drilled earlier should be conducted; hence the application of electrolysis copper plating is vital. Acidic based solutions and alkaline ones are used so that the pH is properly balanced.
The circuit's final design is arrived at with the use of photo imaging. Electroplating copper also helps in arriving at the final required thickness. Application of a thin layer of tin or lead solder takes place to allow for the protection of the final circuits. Removal of the unwanted copper is done as it will not be part of the final circuit. Its etching can be carried out using an acidic or alkaline solution.
Other organic or photosensitive compounds can be used to obtain alternative resists. The compounds can be used when wet or dry. They will become hard when they are exposed to ultraviolet light.
In order to spread the liquid resist, one can use a silk screen, squeegee, roller or spray. One or both sides can have the liquid on. However, application can also be done to a specific area on the surface. Finer circuits can be produced by use of light.
The last stage in this process is forming multi layer panels. The layer's inner cores are assembled together. The resulting product is like a book which has a copper foil with sheets of epoxy that are alternating.
The book is positioned into a laminating press and then high pressure as well as heat is applied to it. The intense heat will eventually cause the sheets to melt down and a bond will be formed. Next, there are holes that are drilled into it. Prior to this, it should undergo some trimming and buffing. Manufacturing of PCB can only be successful if all these steps and guidelines are clearly followed to the latter.
The backing is first plated using a conductive material. Into it, holes are drilled in order for the improvement of conduction in between the layers. Scrubbing of the board is performed to get rid of any unwanted small particles of the conductor. These are then recycled using such methods as filtration. In case the copper particles are not recycled, there could be serious environmental impact if it combines with the other wastes.
Cleaning of the board is then done. In the next stage, there should be adequate adhesion and therefore to enhance this, etching is also done. One more layer of conductor is added next. The holes that had been drilled earlier should be conducted; hence the application of electrolysis copper plating is vital. Acidic based solutions and alkaline ones are used so that the pH is properly balanced.
The circuit's final design is arrived at with the use of photo imaging. Electroplating copper also helps in arriving at the final required thickness. Application of a thin layer of tin or lead solder takes place to allow for the protection of the final circuits. Removal of the unwanted copper is done as it will not be part of the final circuit. Its etching can be carried out using an acidic or alkaline solution.
Other organic or photosensitive compounds can be used to obtain alternative resists. The compounds can be used when wet or dry. They will become hard when they are exposed to ultraviolet light.
In order to spread the liquid resist, one can use a silk screen, squeegee, roller or spray. One or both sides can have the liquid on. However, application can also be done to a specific area on the surface. Finer circuits can be produced by use of light.
The last stage in this process is forming multi layer panels. The layer's inner cores are assembled together. The resulting product is like a book which has a copper foil with sheets of epoxy that are alternating.
The book is positioned into a laminating press and then high pressure as well as heat is applied to it. The intense heat will eventually cause the sheets to melt down and a bond will be formed. Next, there are holes that are drilled into it. Prior to this, it should undergo some trimming and buffing. Manufacturing of PCB can only be successful if all these steps and guidelines are clearly followed to the latter.
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